Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP4CE40F23A7N is part of the highly regarded Cyclone® IV E series, embodying a new era of optimized performance for cost-sensitive applications without compromising on quality. This FPGA (Field-Programmable Gate Array) is encapsulated in a 484-BGA package, designed precisely for surface mount technology, thereby ensuring a robust integration in a variety of circuit boards with a footprint of 484-FBGA (23×23). It is engineered to perform reliably in extreme conditions, as highlighted by its operating temperature range of -40°C to 125°C (TJ), making it suitable for high-temperature environments.
With an impressive count of 39,600 logic elements/cells, this device is built to handle complex algorithms and processes, making it ideal for advanced digital processing tasks. The FPGA boasts 2,475 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs) which form the backbone of its programmable logic capabilities. Additionally, it encompasses a total of 1,161,216 RAM bits, providing substantial memory resources for high-demand applications.
The device supports up to 328 I/O ports, offering ample connectivity options for interfacing with other components in a system. This vast number of I/Os, coupled with its high logic and memory capacity, makes the EP4CE40F23A7N a versatile choice for a breadth of applications, including but not limited to industrial automation, automotive systems, consumer electronics, and telecommunication infrastructure.
Intel’s Cyclone® IV E series FPGAs, including the EP4CE40F23A7N, stand out for their balance of cost, power, and performance, making them a reliable choice for engineers and developers looking to push the boundaries of innovation in their respective fields. The part is currently listed as active, indicating ongoing support and availability for new designs and projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 125°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 39600 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 2475 |
Total RAM Bits | 1161216 |
Part Status | Active |
Number of I/O | 328 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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