Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP4CE30F29I8LN is a high-performance FPGA from Intel’s renowned Cyclone® IV E series, delivering innovative features for cost-sensitive applications. This component is structured with 28,848 logic elements/cells and 1,803 logic array blocks (LABs)/configurable logic blocks (CLBs), providing a robust platform for complex digital circuits. The FPGA leverages a 780-ball Fine-Pitch Ball Grid Array (FBGA) package, measuring 29×29 mm, suitable for compact, surface-mounted designs ensuring efficient space utilization on PCBs.
With its operating temperature range extending from -40°C to 100°C, the EP4CE30F29I8LN is engineered to maintain reliability in varying environmental conditions, making it ideal for demanding applications across industries including telecommunications, automotive, and industrial automation. Its architecture supports a substantial amount of embedded memory, featuring 608,256 total RAM bits, enhancing its capability for data-intensive operations.
This component also boasts an impressive count of 532 user I/Os, allowing extensive interfacing options with other components within a system. Packaged in trays for secure handling and delivery, the EP4CE30F29I8LN continues to be an active part of Intel’s product offerings, showcasing its enduring relevance in the technology ecosystem.
Engineered for high functionality and integration, the EP4CE30F29I8LN represents Intel’s commitment to providing advanced solutions that meet the evolving needs of sophisticated electronic systems, ensuring developers have access to highly capable, reliable components for their design projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 780-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 0.97V ~ 1.03V |
Number of Logic Elements/Cells | 28848 |
Supplier Device Package | 780-FBGA (29x29) |
Number of LABs/CLBs | 1803 |
Total RAM Bits | 608256 |
Part Status | Active |
Number of I/O | 532 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
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DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
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