Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP4CE22F17C6N is a high-performance, low-power FPGA (Field Programmable Gate Array) from the renowned Cyclone® IV E series, engineered to deliver cost-effective and power-efficient solutions for a wide array of applications. Housed in a 256-LBGA (Low-profile Ball Grid Array) package, this FPGA is designed for surface mount technology, ensuring a compact footprint and reliable electrical connection to the printed circuit board.
Boasting 22,320 logic elements/cells and 1,395 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP4CE22F17C6N provides a versatile foundation for the creation and implementation of complex digital circuits. The device supports a substantial amount of embedded memory, featuring 608,256 total RAM bits, which allows for efficient data storage and manipulation within high-performance computing tasks.
Operating within a temperature range of 0°C to 85°C, this FPGA is suitable for industrial applications where reliability under varying thermal conditions is paramount. It offers 153 programmable I/O ports, facilitating robust connectivity with other components in system designs. The package form factor, a 256-FBGA (17x17mm), ensures a minimal footprint while maximizing the performance-to-space ratio, which is critical for advanced embedded systems.
The Intel EP4CE22F17C6N remains an active component, reflecting its ongoing relevance and applicability across a range of industries, including telecommunications, automotive systems, consumer electronics, and Industrial automation. Its extensive logic and memory capabilities make it an ideal choice for developers and engineers looking to leverage high-performance FPGA technology in their next-generation electronic designs.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-LBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 22320 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 1395 |
Total RAM Bits | 608256 |
Part Status | Active |
Number of I/O | 153 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 72 I/O 84PLCC
IC FPGA 83 I/O 100QFP
IC FPGA 387 I/O 676FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 315 I/O 484FBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |