Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP4CE10F17C7N, a high-performance FPGA from Intel’s acclaimed Cyclone® IV E series, stands out for its robust configuration designed to meet the advanced needs of engineering professionals. This component boasts a considerable logic capacity with 10,320 logic elements and 645 logic array blocks (LABs) consistent with its design to support complex digital computations and signal processing applications efficiently.
Housed in a 256-LBGA (Ball Grid Array) package, with dimensions to fit a 256-FBGA footprint of 17×17, this FPGA is optimized for surface mount technology, facilitating seamless integration into a variety of hardware configurations. The operating temperature range of 0°C to 85°C (TJ) ensures reliable performance across a broad spectrum of environmental conditions, highlighting its suitability for industrial applications that demand consistent operation.
With 179 available I/O pins, the EP4CE10F17C7N offers ample interface options, supporting flexible design architectures for sophisticated electronic systems. This feature, coupled with 423,936 total RAM bits, underlines the component’s capacity to handle extensive data throughput—essential for applications in telecommunications, automotive systems, and consumer electronics, where comprehensive data processing and advanced control are paramount.
The ongoing status of the EP4CE10F17C7N as an active part reflects Intel’s commitment to providing long-term support and availability for the Cyclone® IV E series, ensuring that developers can integrate this FPGA into future projects with confidence.
Intel’s EP4CE10F17C7N FPGA merges advanced technological design with practical adaptability, making it a pivotal component in the development of cutting-edge electronic systems that demand high-speed, reliable, and flexible solutions.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-LBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 10320 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 645 |
Total RAM Bits | 423936 |
Part Status | Active |
Number of I/O | 179 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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