The EP3C5M164C7N is a Field-Programmable Gate Array (FPGA) by Intel and a part of the Cyclone® III series. This component comes in a tray packaging variant and features a 164-TFBGA package/case. The mounting type of this FPGA is surface mount, suggesting its viability for various PCB designs. The operating temperature ensures the product’s functionality between 0°C and 85°C (TJ).

The FPGA comprises 5136 logic elements or cells and 321 logic array blocks or complex logic blocks (LABs/CLBs), a powerful combination for intricate computing processes. The higher the number of these sections results in better performance and functionality of the system. This substantial processing power coupled with 423936 total RAM bits reinforces the chip’s robust capabilities and its fitments in sectors needing vast computing power, such as data centers, cloud computing, AI, and more.

This active status component has a supplier device package of 164-MBGA with an 8×8 configuration, indicating the packaging’s high-density functionality. The significant number of inputs/outputs, at 106 I/Os, showcases the FPGA’s capability to handle multiple data streams simultaneously and efficiently. Because of these robust properties, the EP3C5M164C7N is a high-performance, adaptable solution fitting a range of applications within the integrated circuit landscape.