The EP3C5F256C8N, part of Intel’s esteemed Cyclone® III series, is an FPGA (Field-Programmable Gate Array) that stands out for its versatility and robust performance specifications, tailored for precision applications. This component occupies a 256-LBGA (Low-profile Ball Grid Array) package, which along with a surface-mount design, ensures seamless integration into various system architectures scaling from small-scale to complex deployments.

Encapsulated in a tray packaging for secure handling and distribution, the EP3C5F256C8N operates within a temperature range of 0°C to 85°C (TJ), guaranteeing reliability in environments that demand consistent performance. With 5,136 logic elements/cells at its core, it provides substantial logic density for demanding applications. The device further includes 321 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), offering remarkable flexibility for logic implementation.

In terms of memory, this FPGA boasts 423,936 total RAM bits, facilitating efficient data handling and storage capabilities crucial for bandwidth-intensive operations. Furthermore, with 182 I/Os, it provides ample interface options, ensuring compatibility and interconnectivity with a wide array of external devices.

Ideal for a multitude of industries, including but not limited to telecommunications, consumer electronics, and automotive, where high-speed data processing and high-reliability are paramount, the EP3C5F256C8N stands as a testament to Intel’s commitment to innovation and excellence in the FPGA market. Its active part status highlights ongoing support and availability, marking it as a viable option for both current and future project designs.