Introducing the EP3C5E144A7N, a high-performance FPGA from Intel’s renowned Cyclone® III series, designed to meet the advanced requirements of modern electronic systems. Manufactured by Intel, this component showcases the reliability and innovation synonymous with a leader in the semiconductor industry.

The EP3C5E144A7N is presented in a 144-LQFP Exposed Pad package, optimized for surface mount technology, ensuring a seamless fit into a wide range of PCB designs. With an extensive operating temperature range of -40°C to 125°C (TJ), this FPGA is engineered to operate reliably in environments subject to extreme conditions, making it an ideal choice for industrial, automotive, and military applications where performance and durability are crucial.

At the core of the EP3C5E144A7N are 5,136 logic elements/cells and 321 LABs/CLBs, providing a robust platform for complex digital circuit designs. Furthermore, it boasts 423,936 total RAM bits, offering substantial memory capacity for data-intensive tasks. The FPGA features 94 configurable I/O pins, allowing for flexible interfacing with a wide range of peripheral devices.

Housed in a compact 144-EQFP (20×20) supplier device package, the EP3C5E144A7N delivers a balance of performance and footprint, making it highly suitable for space-constrained applications while not compromising on capability.

In summary, the EP3C5E144A7N FPGA from Intel’s Cyclone® III series is a pivotal component for designing advanced electronic systems that demand high-speed, reliability, and adaptability. Its comprehensive features and specifications make it a valuable asset across a range of industries looking to leverage the power of programmable logic in their applications.