Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP3C55U484C6N, belonging to the robust Cyclone® III FPGA series, stands out as a high-capacity field programmable gate array designed to meet the sophisticated demands of modern digital applications. Its compact 484-FBGA packaging allows for efficient integration into a wide range of electronic assemblies, ensuring a streamlined surface mount installation process.
Key technical specifications of the EP3C55U484C6N include:
– A substantial array of 55,856 logic elements/cells and 3,491 logic array blocks (LABs)/configurable logic blocks (CLBs), which facilitate complex digital circuit designs.
– A total of 2,396,160 RAM bits, supporting extensive data storage and manipulation requirements.
– An expansive set of 327 I/O pins, offering versatile connectivity options for various peripheral devices.
– Operational temperature range from 0°C to 85°C, ensuring reliability across a broad spectrum of environmental conditions.
– Housed in a 484-UBGA (19×19) supplier device package, optimizing board space without compromising performance.
Industries such as telecommunications, automotive electronics, consumer electronics, and medical devices benefit greatly from the EP3C55U484C6N’s advanced capabilities, leveraging its exceptional performance for sophisticated control systems, signal processing, and high-speed data transmission tasks. Its active part status further assures availability and support continuity for large-scale and critical projects.
In essence, the Intel EP3C55U484C6N FPGA is a high-caliber component engineered to tackle the complex digital challenges of today’s technological landscape, driving innovation across multiple sectors.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-FBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 55856 |
Supplier Device Package | 484-UBGA (19x19) |
Number of LABs/CLBs | 3491 |
Total RAM Bits | 2396160 |
Part Status | Active |
Number of I/O | 327 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 475 I/O 672FBGA
IC FPGA 322 I/O 484FBGA
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 315 I/O 484FBGA
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