The Intel EP3C55F780I7N is a high-performance FPGA from the Cyclone® III series, crafted for advanced applications requiring a blend of power efficiency and high functionality. This device is encapsulated in a 780-BGA package and designed for surface-mount technology, ensuring a robust and reliable integration into sophisticated electronic systems.

With an extensive array of 55,856 logic elements and 3,491 logic array blocks (LABs/CLBs), this FPGA offers a versatile logic fabric that can accommodate complex digital circuits and algorithms. The product boasts a substantial 2,396,160 total RAM bits, providing ample storage for user applications. It supports a wide operating temperature range from -40°C to 100°C, making it suitable for deployment in environments with stringent temperature requirements.

Featuring 377 input/output pins, the EP3C55F780I7N provides an expansive interface for peripheral connectivity, enabling the design of highly integrated devices. This product, currently active, is delivered in tray packaging, ensuring safe and secure shipment to high-tech industries. The device’s 780-FBGA (29×29) package ensures compact and efficient use of PCB real estate, benefiting designers with space constraints.

This FPGA finds its applications across a diverse range of industries including telecommunications, automotive, consumer electronics, and industrial automation, where its ability to perform high-speed data processing and control functions is critically appreciated. Its robust architecture and extensive logic resources empower developers to push the boundaries of innovation in electronic design.