The Intel Cyclone® III series FPGA, part number EP3C55F780C8N, stands as a key component in the evolution of high-speed computing and digital signal processing applications. Manufactured by Intel, this field-programmable gate array comes in a 780-ball grid array (BGA) package, tailored for surface mount technology, ensuring a seamless integration into a variety of circuit board designs. With its package size detailed as 780-FBGA (29×29), this FPGA is designed to meet the rigorous requirements of a wide range of operating environments, accommodating an operating temperature range from 0°C to 85°C (TJ).

This component is distinguished by its impressive array of 55,856 logic elements/cells and 3,491 logic array blocks (LABs)/configurable logic blocks (CLBs), making it a powerhouse for complex digital circuit implementations. The EP3C55F780C8N is further enhanced by its substantial memory resources, offering a total of 2,396,160 RAM bits, which facilitates the handling of extensive data processing tasks with efficiency and speed.

The device boasts 377 I/O pins, providing extensive connectivity options for peripherals and other components, thereby enhancing its versatility in system design. With its status actively maintained in the market, the EP3C55F780C8N continues to be a reliable choice for developers looking to leverage its high-performance computing capabilities.

Predominantly, this FPGA finds its application across various industries, including telecommunications, automotive, aerospace, and consumer electronics, where its ability to process complex algorithms quickly and efficiently is highly valued. The integration of such a component into electronic systems underscores the commitment to advancing digital technologies that require high data throughput, flexibility, and reliability.