The EP3C25F256C8N belongs to Intel’s Cyclone® III FPGA series, renowned for its high functionality and reliability in various applications. With a 256-LBGA (Low Profile Ball Grid Array) packaging format, this field-programmable gate array ensures seamless surface mount application, facilitating ease of design and integration into a wide range of electronics systems. The component operates within a temperature range of 0°C to 85°C (TJ), making it suitable for environments that demand stable performance under varying thermal conditions.

Comprising 24,624 logic elements/cells and 1,539 logic array blocks/CLBs, the EP3C25F256C8N offers a robust platform for complex digital circuit design, allowing for the implementation of sophisticated functionalities in devices. Its architecture boasts a total of 608,256 RAM bits, providing ample space for data storage and manipulation within the FPGA, enhancing the capabilities of devices in processing and response times.

The FPGA features 156 input/output pins, supporting extensive interfacing opportunities with other components, facilitating a wide range of applications from consumer electronics to industrial systems. The device is packaged in a 256-FBGA format, measuring 17×17, which is optimized for enhanced thermal and signal integrity, crucial for maintaining performance across applications.

Intel’s EP3C25F256C8N is an active component, reflecting its continuing relevance and demand in the market. Its comprehensive feature set makes it a go-to solution for professionals seeking performance, flexibility, and reliability in their FPGA applications.