Analog Devices Amplifiers
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The EP3C16F484I7N is a high-performance FPGA from Intel’s Cyclone® III series, designed to meet the complex computational needs and flexibility requirements of contemporary digital systems. This component features a robust architecture consisting of 15,408 logic elements/cells and 963 logic array blocks/LABs, enabling the development of highly complex digital circuits. It is packaged in a 484-ball fine-pitch Ball Grid Array (FBGA), with dimensions of 23×23, optimized for surface mount technology, facilitating easier integration into a wide range of applications.
With its substantial 516,096 total RAM bits, this device offers ample internal storage to support intricate design functionalities. The EP3C16F484I7N operates over a wide temperature range from -40°C to 100°C (junction temperature), ensuring reliable performance even in challenging environmental conditions. Its capacity for 346 input/output connections provides extensive interfacing capabilities with other devices, enhancing system design flexibility.
This FPGA is ideal for applications across various industries including telecommunications, automotive, industrial automation, and consumer electronics, where its ability to rapidly process and manage large data streams can significantly improve system performance and functionality. The part’s active status ensures ongoing support and availability for new designs and legacy system maintenance.
Intel’s commitment to providing advanced technology solutions is exemplified in the Cyclone® III series, offering developers the tools needed to create innovative products that push the boundaries of what’s possible in electronic design. The EP3C16F484I7N stands out as a testament to this commitment, offering unparalleled performance and flexibility for demanding applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 15408 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 963 |
Total RAM Bits | 516096 |
Part Status | Active |
Number of I/O | 346 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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