The EP3C16F256C6N, part of Intel’s acclaimed Cyclone® III FPGA series, epitomizes high performance and flexibility in a compact 256-LBGA package. Engineered for surface mount assembly, this FPGA stands out with its robust architecture, featuring 15,408 logic elements/cells and 963 logic array blocks/CLBs that ensure a potent blend of speed and efficiency. The device is encapsulated in a 256-FBGA (17×17) package, optimized for thermal performance and minimal footprint on PCBs.

With an extensive operating temperature range of 0°C to 85°C, the EP3C16F256C6N ensures reliability across various environments, marking it as an ideal choice for demanding applications. Its notable 516,096 total RAM bits and 168 I/O pins provide ample flexibility for complex designs requiring substantial memory and high connectivity.

The Cyclone® III series has found applications across numerous industries, benefiting sectors such as automotive, industrial automation, and consumer electronics with its high integration, energy efficiency, and cost-effectiveness. The EP3C16F256C6N, with its active part status, continues to support the innovation and development of sophisticated electronic systems requiring a high degree of programmability and real-time processing capabilities.

As a testament to its versatility and advanced capabilities, the EP3C16F256C6N has been integral in advancing FPGA technology, facilitating the development of products that require high-speed signal processing and intricate logic computations, making it an indispensable component for engineers and designers alike.