The EP2SGX60DF780C4N is a high-performance FPGA from Intel’s Stratix® II GX series, tailored for demanding system-level applications. With its advanced 780-BBGA (Ball Grid Array) packaging, this FPGA is designed for streamlined surface-mount assembly, ensuring a reliable integration into a wide array of electronic assemblies.

Operating within a temperature range of 0°C to 85°C, this device is capable of sustaining optimal performance in various environmental conditions. It boasts an impressive array of features, including 60,440 logic elements and 3,022 logic array blocks (LABs), providing a solid foundation for complex digital circuits and functionalities.

Designed with a substantial amount of on-board memory, the EP2SGX60DF780C4N offers 2,544,192 total RAM bits, facilitating efficient data storage and retrieval operations which are critical in data-intensive applications. Furthermore, the component provides extensive connectivity options with 364 available I/O ports, enabling versatile interfacing with peripherals and other ICs.

Packaged in a 780-FBGA format with dimensions of 29×29, this FPGA is noted for its obsolescence, marking it as a unique find for specialists seeking specific legacy components for their existing or retro projects. Its integration into sectors such as telecommunications, data processing, industrial control systems, and more, underscores its adaptable and powerful design capable of meeting sophisticated computational demands.

Intel’s engagement in pioneering FPGA solutions is exemplified by the Stratix® II GX series, offering a blend of performance, flexibility, and capacity that professionals in the field have come to rely on for their mission-critical applications.