The EP2S90F1020C3N, part of Intel’s renowned Stratix® II series, stands out as a high-performance Field-Programmable Gate Array (FPGA) designed to meet the demanding needs of complex digital systems. Featuring advanced technology encapsulated in a 1020-BBGA, FCBGA package, this component promises robustness and reliability for surface mount applications. It offers a substantial logic capacity with 90,960 logic elements/cells and 4,548 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), making it ideal for high-density integrations.

With an impressive count of 758 available I/O ports, the EP2S90F1020C3N facilitates vast connectivity options, pairing well with the high-speed digital communication requirements prevalent in today’s tech landscape. Furthermore, it boasts a total RAM of 4,520,488 bits, enhancing its capabilities in data processing and storage applications.

Operating within a temperature range of 0°C to 85°C, this FPGA ensures reliable performance across a variety of environmental conditions. Its packaging in bulk as a 1020-FBGA (33×33) device package underscores its suitability for large-scale productions and applications.

Highlights include:
– Part of the high-performance Stratix® II series.
– 1020-BBGA, FCBGA package suitable for surface mount technology.
– Operating temperature range of 0°C ~ 85°C.
– A high number of logic elements/cells: 90,960.
– Total RAM bits: 4,520,488.
– 758 I/O ports for comprehensive connectivity.

Primarily utilized in telecommunications, industrial automation, military and aerospace applications, the EP2S90F1020C3N by Intel delivers exceptional performance and flexibility, making it an essential choice for designers and engineers focused on developing cutting-edge digital systems.