The EP2S30F672C3N, crafted by Intel, stands as a sophisticated FPGA (Field-Programmable Gate Array) belonging to the acclaimed Stratix® II series. Housed in a 672-FBGA package with dimensions of 27×27, this component ensures robust performance with its surface mount configuration, making it a reliable choice for leading-edge system designs. With an operating temperature range of 0°C to 85°C (TJ), it delivers adaptable performance across various environments.

This FPGA is distinguished by its substantial capacity, featuring 33,880 logic elements/cells and 1,694 LABs/CLBs, indicative of its high complexity and versatility in handling intricate logic operations. It further boasts a significant total RAM bits count of 1,369,728, augmenting its potential for data-intensive applications. The device comes equipped with an impressive array of 500 I/O ports, offering extensive connectivity options for diverse components and systems.

Although now marked obsolete, the EP2S30F672C3N has historically been pivotal in driving innovations across multiple industries, including but not limited to telecommunications, automotive, and consumer electronics, underpinning the development of advanced digital systems and integrating high-speed data processing capabilities.

Intel’s Stratix® II series, renowned for its high performance and functionality, caters to designers and engineers looking for FPGAs capable of meeting rigorous computational and processing demands, thereby facilitating the creation of sophisticated, high-performance applications.