The EP2C70F896C8N is a high-performance FPGA from Intel’s renowned Cyclone® II series, engineered to meet the complex requirements of advanced digital processing. Housed in an 896-BGA package, this surface mount FPGA operates efficiently within a temperature range of 0°C to 85°C (TJ), ensuring reliability and stability in varied operational environments.

With an impressive array of 68,416 logic elements/cells and 4,276 LABs/CLBs, this component offers robust flexibility and scalability for designing intricate digital circuits. The device is complemented by a substantial 1,152,000 total RAM bits, providing ample memory resources for high-demand applications. Additionally, its 896-FBGA (31×31) supplier device package is designed to optimize board layout and minimize space consumption.

Supporting up to 622 I/O pins, the EP2C70F896C8N provides extensive connectivity options, making it an ideal choice for applications requiring high-density I/O interfaces. Its active part status underlines its continued relevance and availability in today’s market, ensuring long-term support for developers and manufacturers.

This FPGA finds its applications in a myriad of industries, including telecommunications, automotive, industrial automation, and consumer electronics, reflecting its versatility and adaptability to various technological ecosystems. Its performance and specifications make it suitable for demanding tasks such as digital signal processing, complex logic operations, and system integration, providing developers an efficient, reliable platform for innovation and product development.