The Intel EP2C70F672I8N is a high-performance FPGA part of the renowned Cyclone® II series, designed to meet the rigorous demands of advanced digital processing in a compact 672-BGA package. This FPGA is specifically tailored for surface mount technology, ensuring a seamless integration into a wide array of printed circuit boards. With an operating temperature range of -40°C to 100°C, it ensures reliable performance in diverse environmental conditions.

Boasting 68,416 logic elements/cells and 4,276 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), the EP2C70F672I8N is engineered for complex digital circuitry, offering ample room for innovation and design scalability. Its extensive on-chip memory of 1,152,000 total RAM bits facilitates efficient data handling and processing, making it a pillar for memory-intensive applications.

The device features 422 input/output (I/O) pins, providing extensive connectivity options and interface flexibility, highlighting its capability to support a wide range of peripherals and external devices. Packaged in a 672-FBGA with a footprint of 27×27 mm, it emphasizes a compact design without compromising on functionality or performance.

Ideal for applications in telecommunications, networking, automotive systems, and consumer electronics, the EP2C70F672I8N FPGA from Intel presents a robust solution for developers looking to push the boundaries of what’s possible within their digital systems. As a part of the active product line, it continues to be a preferred choice for professionals aiming to leverage the cutting-edge technology and reliability associated with the Intel and the Cyclone® II series.