Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP2C70F672C7N, manufactured by Intel, is a high-capacity Field-Programmable Gate Array (FPGA) that forms part of the renowned Cyclone® II series, known for their exceptional performance and flexibility in a wide range of applications. This component is presented in a 672-Ball Grid Array (BGA) package, engineered for surface mount technology, making it suitable for compact and sophisticated designs where space and reliability are of paramount importance.
With an impressive array of 68,416 logic elements and 4,276 Logic Array Blocks (LABs), this FPGA is designed to support the creation and implementation of complex digital systems. It encompasses 1,152,000 total RAM bits to accommodate high-speed data processing and storage requirements. One of the standout features of the EP2C70F672C7N is its extensive input/output capability, boasting 422 I/O pins, providing extensive interfacing options with other components within systems.
The device operates efficiently across a temperature range of 0°C to 85°C, ensuring reliable performance in environments that can challenging. Its status remains active, indicating consistent availability and support for both existing applications and new projects.
This FPGA is pivotal in the development of advanced digital computing systems, networking equipment, telecommunications infrastructure, and embedded applications. Its high logic capacity and flexible RAM configuration make it an ideal choice for professionals engaged in designing high-performance, innovative products across industries such as computing, communications, industrial, and beyond.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 672-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 68416 |
Supplier Device Package | 672-FBGA (27x27) |
Number of LABs/CLBs | 4276 |
Total RAM Bits | 1152000 |
Part Status | Active |
Number of I/O | 422 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 248 I/O 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 72 I/O 84PLCC
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
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