The Intel EP2C50F672I8N is a high-performance FPGA from the Cyclone® II series, known for its advanced system-level integration capabilities. It features a dense 672-Ball Grid Array (BGA) packaging, making it suitable for sophisticated surface mount technology applications. With an operating temperature range of -40°C to 100°C, this component guarantees reliability under extreme conditions, catering to a broad spectrum of industrial applications.

This FPGA boasts 50,528 logic elements and 3,158 Logic Array Blocks (LABs), providing a robust platform for complex digital circuit designs. The device is equipped with a remarkable 594,432 bits of embedded RAM, enhancing data processing and storage capabilities in system designs. With up to 450 I/O pins, the EP2C50F672I8N offers extensive connectivity options, enabling designers to incorporate a wide range of peripherals and interfaces.

Intel’s Cyclone® II series of FPGAs are popular in various industries due to their balance of cost, power consumption, and performance. The EP2C50F672I8N is particularly suitable for applications requiring high-speed data processing and efficient logic implementation, such as telecommunications, automotive systems, and industrial automation.

This FPGA is currently active and available, ensuring long-term availability and support for projects requiring stable and reliable programmable logic solutions. Its comprehensive feature set and high reliability make the EP2C50F672I8N a preferred choice for engineers and developers looking to push the boundaries of innovation in FPGA-based designs.