Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP2C35F484I8N, part of Intel’s renowned Cyclone® II series, stands as a formidable FPGA (Field-Programmable Gate Array) designed to meet the sophisticated requirements of modern computing and electronic systems. This component is presented in a 484-Ball Grid Array (BGA) package, ensuring a compact form factor for streamlined surface mounting, aiding in the development of densely packed electronic assemblies. With an operating temperature range of -40°C to 100°C, it guarantees reliability and performance in a wide array of environmental conditions.
Boasting 33,216 logic elements/cells and 2,076 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP2C35F484I8N offers a versatile foundation for complex digital logic circuits, allowing for the creation and implementation of custom logic functions tailored to specific application needs. The FPGA also incorporates 483,840 total RAM bits, providing substantial internal storage for user-defined data and configurations.
With 322 I/O pins, this component facilitates extensive connectivity options for peripheral devices, making it an ideal choice for applications requiring high levels of data exchange and signal processing. The Cyclone® II series is recognized for its efficiency and performance, particularly in sectors such as telecommunications, automotive systems, consumer electronics, and industrial automation, underlining its adaptability to a broad range of demanding applications.
The EP2C35F484I8N is currently marked as active, indicating its availability and ongoing support for new designs and existing platforms requiring a high-performance, reconfigurable computing solution. Its robust feature set and operational flexibility make it a valuable asset for engineers and designers seeking to push the boundaries of technology and innovation.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 33216 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 2076 |
Total RAM Bits | 483840 |
Part Status | Active |
Number of I/O | 322 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 475 I/O 672FBGA
IC FPGA 532 I/O 780FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 207 I/O 400VFBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 113 I/O 144TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 150 I/O 324CSBGA
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