Analog Devices Amplifiers
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The Intel EP2C20F256C6N is a high-performance FPGA (Field-Programmable Gate Array) from the Cyclone® II series, engineered to meet the rigorous demands of a wide range of applications across various industries including telecommunications, automotive, industrial automation, and consumer electronics. This component is housed in a 256-LBGA (Low Profile Ball Grid Array) package, with surface mount technology for secure placement on circuit boards.
With an operating temperature range of 0°C to 85°C, this FPGA is designed to deliver optimal performance in environments where temperature variations are a concern. It features a substantial number of logic elements and cells, totaling 18,752, and 1,172 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), enabling complex logic circuits to be implemented with a single chip.
The device boasts a significant amount of integrated RAM, with 239,616 total RAM bits, facilitating efficient data processing and storage capabilities. The EP2C20F256C6N offers a flexible I/O interface with 152 I/O pins, allowing for a versatile connection to other components within a system.
Packaged in a tray for enhanced protection during shipping and handling, and with an active part status, this FPGA assures manufacturers and designers of its availability and ongoing support. The inclusion of a 256-FBGA supplier device package further attests to its robustness and reliability for sophisticated electronic designs. Its comprehensive feature set makes it an ideal choice for developers looking to leverage advanced digital logic functionality in their projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-LBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 18752 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 1172 |
Total RAM Bits | 239616 |
Part Status | Active |
Number of I/O | 152 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 532 I/O 780FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 113 I/O 144TQFP
IC FPGA 150 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
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