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EP2AGX95DF25C6G

IC FPGA 260 I/O 572FBGA

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$1,302.45

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Introducing the EP2AGX95DF25C6G, a high-performance FPGA from Intel’s esteemed Arria II GX series, designed to meet the complex needs of today’s fast-paced electronic industry. Manufactured by Intel, a leader in semiconductor innovation, this component offers an ideal blend of speed, power efficiency, and flexibility, making it a prime choice for advanced applications.

Technical specifications and features of the EP2AGX95DF25C6G include:
– A robust 89178 logic elements/cells and 3747 LABs/CLBs for intricate digital computations.
– A substantial 6,839,296 bits of RAM, facilitating extensive data storage and management.
– An array of 260 I/O pins, providing ample connectivity options for various peripherals and interfaces.
– Packaged expertly in a 572-BGA, FCBGA form factor with a 25×25 supplier device package, optimized for surface mount technology.
– Operates efficiently across a 0°C to 85°C temperature range, ensuring reliability in varying environmental conditions.
– Part of the active product line, highlighting its relevance and ongoing support by the manufacturer.

Engineered for use in a variety of industries, including telecommunications, automotive, industrial automation, and consumer electronics, the EP2AGX95DF25C6G FPGA is a testament to Intel’s commitment to delivering cutting-edge technology solutions. Its versatility and high-performance capabilities make it an essential component in the design of complex digital systems requiring high-speed signal processing, system integration, and energy efficiency.

With its combination of advanced features and support for a wide range of applications, the EP2AGX95DF25C6G stands out as a top-tier solution for professionals seeking to push the boundaries of innovation in electronic design and development.

Additional information

Additional Information

Series: Arria II GX
RoHS Status: RoHS Compliant
Manufacturer Lead Time: 47 week(s)
Product Status: Active
Packaging: Tray

Datasheet:

Not Available

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case572-BGA, FCBGA
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply0.87V ~ 0.93V
Number of Logic Elements/Cells89178
Supplier Device Package572-FBGA, FC (25x25)
Number of LABs/CLBs3747
Total RAM Bits6839296
Part StatusActive
Number of I/O260
ProgrammableNot Verified
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