The EP2AGX95DF25C4G, a distinguished product from Intel, embodies the advanced capabilities of the Arria II GX series, renowned for its exceptional performance in FPGA (Field-Programmable Gate Array) technology. This component is engineered for high-density integrations, encapsulated in a 572-BGA, FCBGA package ensuring optimal footprint and performance in surface mount applications. With an operating temperature range from 0°C to 85°C (TJ), it guarantees reliability across diverse environmental conditions.

Boasting a substantial number of logic elements/cells totaling 89,178, this FPGA is designed to cater to complex digital computations and signal processing tasks. It is coupled with 3,747 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) that facilitate versatile logic configurations. Moreover, the inclusion of 6,839,296 total RAM bits underscores its capacity for handling extensive data storage and manipulation requirements.

Its package is carefully selected to be the 572-FBGA, FC (25×25), which is meticulously engineered for efficient space utilization and performance optimization on the PCB. With 260 I/O pins, it provides ample connectivity for interfacing with a wide range of peripherals and external devices, thus enhancing its utility in a multitude of applications.

The Arria II GX series, and specifically the EP2AGX95DF25C4G, is actively employed across various industries, including but not limited to telecommunications, data processing, and industrial automation, where its high-speed signal processing capabilities and substantial logic density are of paramount importance. This active component is a testament to Intel’s commitment to delivering cutting-edge technology solutions.