The EP2AGX65DF29I3G, crafted by industry leader Intel, stands as a pivotal component within the FPGA category, belonging to the esteemed Arria II GX series. This advanced field-programmable gate array is meticulously packaged into a 780-BBGA, FCBGA format, ensuring a seamless integration into various device architectures via surface mount technology. It is engineered to operate efficiently across a wide temperature range, from -40°C to 100°C (TJ), which speaks volumes about its reliability and durability in demanding conditions.

Equipped with a substantial number of logic elements/cells totaling 60,214 and supported by 2,530 logic array blocks/clusters (LABs/CLBs), this FPGA is adept at facilitating complex digital computations and processes. It boasts an impressive total RAM bits of 5,371,904, enhancing its capability for high-performance computing tasks. With a generous allocation of 364 I/O ports, the device offers ample connectivity options, making it an adaptable solution for a wide array of applications.

The component is encapsulated in a 780-FBGA (29×29) supplier device package, which is a testament to Intel’s commitment to delivering compact yet powerful technology solutions. Given its active part status, the EP2AGX65DF29I3G is readily available for integration into sophisticated systems, making it an invaluable asset across industries where performance and precision are paramount, such as telecommunications, data processing, and advanced consumer electronics.

This FPGA from Intel’s Arria II GX series exemplifies cutting-edge technology designed to meet and exceed the requirements of modern, high-performance computing environments.