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EP2AGX65DF25C6N

IC FPGA 252 I/O 572FBGA

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$450.00

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The EP2AGX65DF25C6N is a high-performance FPGA from Intel’s esteemed Arria II GX series, designed for demanding applications requiring rapid data processing and high levels of logic integration. This component, packaged neatly in a 572-BGA, FCBGA format, offers unparalleled reliability for surface mount technology with its robust 0°C ~ 85°C operating temperature range.

Key attributes of the EP2AGX65DF25C6N include an impressive array of 60,214 logic elements/cells and 2,530 logic array blocks/CLBs, making it capable of facilitating complex digital computations and signal processing tasks. Moreover, the device boasts a substantial 5,371,904 total RAM bits, ensuring ample storage for user applications, alongside a versatile set of 252 I/O ports for comprehensive connectivity options.

Crafted with precision and advanced technological standards, this FPGA finds its applications across a myriad of industries, including telecommunications, computing, defense, aerospace, and more, where high-speed data processing and unmatched performance are paramount.

Key Features:

– Packaged in a 572-FBGA, FC (25×25) for robust surface mount applications
– Operates efficiently within a temperature range of 0°C to 85°C
– Houses 60,214 logic elements/cells for intricate digital processing
– Includes 2,530 LABs/CLBs, facilitating versatile program logic
– Offers 5,371,904 total RAM bits for extensive data storage
– Provides 252 I/O ports for comprehensive connectivity
– Noted for its status as an obsolete component, suggesting a unique value for specialized applications or collectors

The EP2AGX65DF25C6N from Intel’s Arria II GX series represents the pinnacle of FPGA technology, delivering unparalleled performance for applications demanding rigorous data processing and flexible logic configuration.

Additional information

Additional Information

Series: Arria II GX
RoHS Status: RoHS Compliant
Manufacturer Lead Time: No lead time information available
Product Status: Obsolete
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case572-BGA, FCBGA
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply0.87V ~ 0.93V
Number of Logic Elements/Cells60214
Supplier Device Package572-FBGA, FC (25x25)
Number of LABs/CLBs2530
Total RAM Bits5371904
Part StatusObsolete
Number of I/O252
ProgrammableNot Verified
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