The EP2AGX45DF29C6N, manufactured by Intel, stands as a pivotal component within the realm of Field Programmable Gate Arrays (FPGAs), belonging to the esteemed Arria II GX series. This high-performance device is packaged in a 780-BBGA, FCBGA format, designed for surface mount technology, ensuring seamless integration with a broad array of printed circuit boards (PCBs).

With an impressive count of 42,959 logic elements/cells and 1,805 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA is engineered to tackle complex digital computations and signal processing tasks. The device boasts a substantial amount of embedded RAM, totaling 3,517,440 bits, facilitating the design of high-throughput, memory-intensive applications.

Operating within a temperature range of 0°C to 85°C (TJ), the EP2AGX45DF29C6N is versatile for use in environments with varying thermal conditions. It supports a wide array of interfaces with its 364 I/O pins, making it a highly adaptable solution for designers looking to interface with peripherals and other components.

Originally housed in a 780-FBGA (29×29) package, this FPGA is noted for its obsolescence, indicating its unique place in the history of semiconductor evolution and its continued relevance in specific applications where legacy support is paramount.

The Arria II GX series, to which this FPGA belongs, is renowned for its optimized balance between power efficiency and performance, catering to applications in telecommunications, broadcasting, and industrial sectors, among others. This particular device, with its extensive feature set and adaptability, underscores Intel’s commitment to providing innovative solutions that meet the intricate requirements of advanced digital systems design.