The EP2AGX45DF25I3G, part of Intel’s Arria II GX series, stands as a high-performance Field-Programmable Gate Array (FPGA) designed to meet the demanding requirements of high-speed communication, and industrial applications. Housed in a 572-ball Fine-Pitch Ball Grid Array (FCBGA) with a compact 25×25 mm footprint, it offers a surface mount solution tailored for dense board layouts. Its robust design ensures reliable operation in environments with operating temperatures ranging from -40°C to 100°C (TJ).

Engineered with 42,959 logic elements and 1,805 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA is optimized for versatility, allowing rapid deployment of customized logic to accommodate a range of functionalities. Additionally, its substantial memory capacity, comprising 3,517,440 total RAM bits, enhances its applicability in data-intensive scenarios.

Characteristics and specifications include:

– Packaged in a tray, facilitating secure handling and storage.
– Surface Mount technology compatible, allowing for efficient assembly.
– Integrated with 252 Input/Output (I/O) pins, it provides extensive interfacing capabilities.
– Active part status, confirming its availability and ongoing support.

The EP2AGX45DF25I3G is utilized across various industries, notable for its application in telecommunications equipment, networking hardware, and complex digital signal processing tasks. Its adaptability and high performance make it particularly advantageous in designing advanced, high-speed digital systems.

Key features:
– 572-BGA, FCBGA packaging for compact integration.
– Rated for operation across a wide temperature range from -40°C to 100°C.
– Contains 42,959 logic elements and 1,805 LABs/CLBs for flexible design implementation.
– Features 3,517,440 total RAM bits for superior data management.
– Equipped with 252 I/O ports, supporting extensive peripheral connectivity.