Intel’s EP2AGX45DF25I3 FPGA, from the renowned Arria II GX series, positions itself as a cornerstone in the development of high-speed computing solutions. Engineered for precision and performance, this component is encapsulated in a 572-BGA, FCBGA package, ensuring robustness and reliability in a compact form factor. This surface mount device operates efficiently across a wide temperature range from -40°C to 100°C (TJ), making it versatile across various environmental conditions.

The EP2AGX45DF25I3 is distinguished by its substantial number of logic elements/cells, totaling 42959, alongside 1805 LABs/CLBs, which facilitate complex logic functions and processes. Furthermore, it boasts an expansive I/O count of 252, providing ample connectivity options for intricate system designs. With 3517440 total RAM bits, it ensures ample memory resources for high-demand applications.

Despite its status as an obsolete product, the EP2AGX45DF25I3 remains a valuable component within various industry sectors, including but not limited to telecommunications, advanced computing, and aerospace systems, where reliability and performance cannot be compromised.

Key features include:
– Packaged in a 572-FBGA, FC (25×25) for high durability and optimal footprint.
– Surface Mount Technology (SMT) for modern, high-density PCB designs.
– Operates across a broad temperature range (-40°C to 100°C), ensuring reliability under extreme conditions.
– Robust logic element and LAB/CLB count for intricate digital logic designs.
– Comprehensive connectivity with 252 I/Os for versatile system integration.
– High total RAM capacity supporting complex processing needs.

This FPGA by Intel demonstrates a synergy of performance and flexibility, setting a benchmark for sophisticated system designs in demanding environments.