Intel’s EP2AGX45DF25C6 FPGA stands out as a key component in the Arria II GX series, tailored for high-speed applications requiring exceptional performance and reliability. This FPGA, encapsulated in a 572-BGA, FCBGA package, is designed for surface mounting, ensuring a seamless and secure integration into various circuit boards. The device operates optimally within a temperature range of 0°C to 85°C (TJ), making it versatile for use in a diverse array of environmental conditions.

Key Specifications:
– Manufacturer: Intel
– Series: Arria II GX
– Part Number: EP2AGX45DF25C6
– Packaging: Tray
– Package/Case: 572-BGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature: 0°C ~ 85°C (TJ)
– Number of Logic Elements/Cells: 42,959
– Supplier Device Package: 572-FBGA, FC (25×25)
– Number of LABs/CLBs: 1,805
– Total RAM Bits: 3,517,440
– Part Status: Obsolete
– Number of I/O: 252

The EP2AGX45DF25C6 excels in environments requiring high-density logic integration, thanks to its comprehensive array of 42,959 logic elements and 1,805 LABs/CLBs. With a substantial 3,517,440 total RAM bits and 252 I/O pins, this FPGA is engineered to tackle the most demanding data processing and signal management tasks. Although classified as obsolete, its robust feature set continues to make it sought after for legacy systems within telecommunications, industrial control, and automotive industries, where high-speed data transmission and processing are critical.

In conclusion, the Intel EP2AGX45DF25C6 FPGA from the Arria II GX series is an exceptional choice for professionals seeking powerful performance, extensive integration capabilities, and reliability in high-speed application environments.