The EP2AGX260FF35I3G, developed by Intel, is a high-performance FPGA from the esteemed Arria II GX series, specifically crafted for advanced applications that demand robust speed and functionality. This component, packaged in a 1152-BBGA (FCBGA) with a surface mount configuration, is designed to withstand operating temperatures ranging from -40°C to 100°C (TJ), ensuring reliability in extreme conditions.

Equipped with a substantial 244,188 logic elements/cells and 10,260 logic array blocks (LABs)/configurable logic blocks (CLBs), the EP2AGX260FF35I3G meets the needs of complex digital processing tasks. Furthermore, it provides extensive memory resources with a total of 12,038,144 RAM bits, facilitating the efficient handling of data-intensive operations. The device features an expansive 612 I/O ports, enabling versatile connectivity and integration capabilities within a multitude of systems.

With its advanced architecture and expansive feature set, the EP2AGX260FF35I3G is ideally suited for use in various industries, including telecommunications, networking, and high-end computing, where its capacity to support high-speed signal processing and data management is of paramount importance.

Key Features:
– Manufacturer: Intel
– Series: Arria II GX
– Part Number: EP2AGX260FF35I3G
– Package / Case: 1152-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature Range: -40°C ~ 100°C (TJ)
– Logic Elements/Cells: 244,188
– LABs/CLBs: 10,260
– Total RAM Bits: 12,038,144
– Number of I/O: 612
– Part Status: Active
– Packaging: Tray
– Supplier Device Package: 1152-FBGA (35×35)

This FPGA’s versatility and performance make it an essential component for developing the next generation of high-speed, data-driven technologies in cutting-edge fields.