The Intel EP2AGX260FF35I3 FPGA, a crucial component from the high-performance Arria II GX Series, stands out for its advanced features tailored to demanding applications. Its 1152-ball fine-pitch ball grid array (FBGA) packaging ensures a compact footprint while providing robust connection integrity on a surface-mount board. With operating temperatures ranging from -40°C to 100°C, this FPGA can reliably perform in harsh environments, making it an indispensable choice for industrial, automotive, and communication sectors where reliability and endurance are paramount.

Key specifications include:

– Package / Case: 1152-BBGA, FCBGA for streamlined surface mount integration
– Operating temperature suited for extreme conditions: -40°C ~ 100°C
– A vast network of Logic Elements/Cells totaling 244,188, enabling complex logic functions
– Supplier Device Package: 1152-FBGA (35×35), optimized for space efficiency and performance
– Number of LABs/CLBs: 10,260, providing the backbone for the FPGA’s logic architecture
– An impressive total of 12,038,144 RAM bits, facilitating extensive data processing and storage
– Part Status: Obsolete, highlighting the component’s specific position in lifecycle management
– Number of I/O: 612, allowing extensive external interfacing for versatile application use

This FPGA’s impressive array of logic elements, LABs/CLBs, total RAM bits, and I/Os, combined with its robust packaging and temperature resilience, underscores its suitability for sophisticated projects in sectors requiring high-reliability components. Despite its discontinuation, the EP2AGX260FF35I3 remains a sought-after part for specialized applications where its unique specifications are unparalleled.