The EP2AGX260FF35C6N, part of Intel’s esteemed Arria II GX series, is an FPGA that comes in a 1152-BBGA, FCBGA package designed for surface mount. This device operates within a junction temperature range of 0°C to 85°C, catering to a broad spectrum of environmental conditions. It boasts 244,188 logic elements/cells and 10,260 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), offering a flexible and scalable architecture for complex designs.

With a substantial amount of embedded memory, it provides 12,038,144 total RAM bits, ensuring ample storage for high-performance applications. Additionally, it offers 612 I/O pins, allowing for versatile connectivity options. Packaged in a 1152-FBGA (35×35), it is designed for space-efficient layouts, crucial for high-density board designs.

Though marked as obsolete, the EP2AGX260FF35C6N remains a highly capable component for applications requiring high-speed data processing, including but not limited to telecommunications, industrial, automotive, and defense sectors. Its advanced feature set and robust performance metrics make it an excellent choice for engineers and professionals aiming to leverage high-speed signal processing and complex logic implementation in their projects. This component embodies the commitment to innovation and quality that Intel’s FPGA offerings are renowned for.