The EP2AGX190EF29I5G is a high-performance field-programmable gate array (FPGA) from Intel’s Arria II GX series, designed to meet the demanding requirements of high-speed and high-density applications. This component is fabricated in a 780-BBGA, FCBGA package, ensuring a robust and reliable connection when mounted onto a surface mount board. It operates over a broad temperature range of -40°C to 100°C, accommodating various environmental conditions present in industrial applications.

This FPGA boasts an impressive array of features designed for advanced systems, including:
– A vast array of 181,165 logic elements/cells that allow for the implementation of complex logic functions.
– 7,612 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing flexible and efficient logic implementation.
– A substantial memory capacity with 10,177,536 total RAM bits for high-performance data processing.
– 372 available I/O pins, offering extensive connectivity options for various peripheral devices.

With its advanced capabilities, the EP2AGX190EF29I5G is ideally suited for applications across a wide range of industries, including telecommunications, networking, military and defense, and high-performance computing systems. Its active part status indicates ongoing manufacturer support and availability, making it a reliable choice for new designs and projects aiming for cutting-edge performance and reliability.

Key Features:
– Manufacturer: Intel
– Series: Arria II GX
– Packaging: Tray
– Package/Case: 780-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature: -40°C ~ 100°C (TJ)
– Logic Elements/Cells: 181,165
– Supplier Device Package: 780-FBGA (29×29)
– LABs/CLBs: 7,612
– Total RAM Bits: 10,177,536
– Number of I/O: 372
– Part Status: Active