Introducing the EP2AGX125EF29C6G from Intel’s Arria II GX series, a high-performance FPGA designed for complex digital computing tasks. Manufactured with precision, this component is encapsulated in a 780-pin Fine-Pitch Ball Grid Array (FBGA) package, ensuring a robust surface mount solution for high-density board designs. It is optimized for a wide operating temperature range, from 0°C to 85°C, accommodating various application environments.

Key Specifications:

– Manufacturer: Intel
– Series: Arria II GX
– Part Number: EP2AGX125EF29C6G
– Package / Case: 780-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature Range: 0°C ~ 85°C (TJ)
– Logic Elements/Cells: 118,143
– Supplier Device Packaging: 780-FBGA (29×29)
– LABs/CLBs: 4964
– Total RAM Bits: 8,315,904
– Active Part Status
– I/O Number: 372

This FPGA is a testament to Intel’s commitment to delivering state-of-the-art processing capabilities, with a considerable number of Logic Elements and LABs/CLBs, enabling the design and development of highly complex digital systems. The substantial amount of embedded RAM facilitates efficient data handling and storage, crucial for demanding applications in telecommunications, data processing, and high-speed networking.

Industries benefitting from the EP2AGX125EF29C6G include:

– Aerospace and Defense, for advanced navigation systems and secure communication links.
– Automotive, especially in driver assistance systems and infotainment.
– Data Centers, improving processing speed and handling vast amounts of data.
– High-Performance Computing (HPC), where processing power and speed are critical.

The Arria II GX series is renowned for its performance in applications requiring high-speed transceivers, integrated memory controllers, and exceptional logic density, making the EP2AGX125EF29C6G an ideal choice for professionals seeking advanced, reliable solutions in FPGA technology.