The Intel EP2AGX125DF25I3G, part of the distinguished Arria II GX series, is a field-programmable gate array (FPGA) designed for advanced, high-performance applications. With a package size of 572-BGA, FCBGA and designed for surface mount technology, this FPGA facilitates efficient integration into a wide array of electronic assemblies. Boasting a robust operating temperature range from -40°C to 100°C, this component ensures reliable performance in demanding environments.

With an impressive configuration of 118,143 logic elements/cells housed within its architecture, the EP2AGX125DF25I3G is engineered to address complex computational tasks efficiently. Additionally, the FPGA encompasses 4,964 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing immense flexibility and scalability for various application needs.

The device is further equipped with a substantial 8,315,904 total RAM bits, enhancing its capability to handle data-intensive processes. Its active status ensures availability and support for ongoing and future projects. With 260 available I/O ports, this component allows for extensive connectivity options, making it ideal for a diverse range of applications, including but not limited to telecommunications, networking, and industrial automation, where reliability and performance are paramount.

Packaged in a 572-FBGA, FC (25×25) supplier device package, the EP2AGX125DF25I3G promises a compact yet powerful solution for developers and engineers looking to harness the full potential of FPGA technology in their projects.