Designed by Intel, the EP2A70F1508C9 is a cutting-edge Field-Programmable Gate Array (FPGA) from the APEX II series, developed to meet the high-performance requirements across various industries including telecommunications, aerospace, automotive, and data processing. This component is engineered for surface mount technology, ensuring a seamless integration into existing architectures with a 1508-BBGA, FCBGA package that provides robust support for complex designs.

Featuring a dynamic array of 67,200 logic elements and 6,720 logic array blocks (LABs), the EP2A70F1508C9 offers a versatile foundation for the development of high-density, programmable digital circuits. With its substantial total RAM bits of 1,146,880, this FPGA is poised to handle intricate processing tasks, elevating efficiency and performance within systems.

The device stands out due to its exceptional I/O capabilities, comprising 1,060 programmable input/output options. This vast number of I/O ports facilitates extensive connectivity options, making it an ideal choice for applications requiring high levels of data exchange and interfacing.

Key specifications include:
– Package: 1508-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature Range: 0°C ~ 85°C (TJ)
– Number of Logic Elements/Cells: 67,200
– Supplier Device Package: 1508-FBGA (40×40)
– Number of LABs/CLBs: 6,720
– Total RAM Bits: 1,146,880
– Number of I/O: 1,060

Despite its status as an obsolete component, the EP2A70F1508C9 remains a vital resource for developers looking to leverage Intel’s renowned FPGA technology in their existing systems, offering a sophisticated blend of programmability, connectivity, and performance.