The Intel EP2A25B724C7 is a high-performance FPGA from the esteemed APEX II series, designed to cater to a wide range of industrial applications. Packaged in bulk, this component is encapsulated in a 724-BBGA, FCBGA package, ensuring robust performance in a compact footprint. It is specifically configured for surface mount technology, aligning with modern PCB assembly techniques for streamlined manufacturing processes.

Characterized by its expansive I/O capability, the EP2A25B724C7 offers an impressive 540 inputs/outputs, providing extensive connectivity options for complex designs. This flexibility makes the FPGA suitable for numerous applications, including but not limited to telecommunications, data processing, aerospace, and defense industries, where reliability and high-speed data processing are critical.

Operating within a temperature range of 0°C to 85°C (TJ), this FPGA is designed to maintain its integrity and performance under varying environmental conditions, making it a viable choice for systems that are exposed to fluctuating thermal conditions.

Features include:

– Manufacturer: Intel
– Category: FPGAs
– Series: APEX II
– Packaging: Bulk
– Package / Case: 724-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature: 0°C ~ 85°C (TJ)
– Supplier Device Package: 724-BGA (35×35)
– Part Status: Active
– Number of I/O: 540

The Intel EP2A25B724C7 FPGA stands out in its field for its blend of high I/O count, robust operating temperature range, and compact package design, positioning it as an indispensable component in the design and development of sophisticated electronic systems across various high-demand industries.