Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP20K1000EFC672-2X is a high-density Field-Programmable Gate Array (FPGA) from Intel’s renowned APEX-20KE® series, engineered to meet the demanding needs of advanced digital systems. This component, offered in a 672-BBGA package for surface mount applications, is tailored for a broad spectrum of industrial applications, ranging from sophisticated networking equipment to high-performance computing systems, thanks to its high logic capacity and versatility.
With an operational temperature range of 0°C to 85°C, this FPGA is designed for reliability and performance under varying environmental conditions. It boasts 38,400 logic elements/cells and 3,840 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing a robust platform for complex digital circuitry and signal processing tasks. The device also features 327,680 total RAM bits, enhancing its capability for data-intensive operations.
The EP20K1000EFC672-2X is equipped with 508 input/output pins, offering extensive connectivity options for interfacing with a wide array of peripherals and other ICs. Its package is a 672-FBGA (27×27), ensuring compact integration into system designs without sacrificing capability or functionality.
Although marked as obsolete, its advanced feature set and high integration level make it a viable option for developing sophisticated systems where performance and flexibility are paramount. The APEX-20KE® series is celebrated for its contribution to elevating the potential of digital systems across various sectors, underlining the enduring relevance of the EP20K1000EFC672-2X in legacy and specialized applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 672-BBGA |
Mounting Type | Surface Mount |
Number of Gates | 1772000 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.71V ~ 1.89V |
Number of Logic Elements/Cells | 38400 |
Supplier Device Package | 672-FBGA (27x27) |
Number of LABs/CLBs | 3840 |
Total RAM Bits | 327680 |
Part Status | Obsolete |
Number of I/O | 508 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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