Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1S30F1020C7, produced by Intel, is part of the highly respected Stratix® FPGA series, known for its robust performance and flexibility. This component, packaged in a 1020-BBGA, FCBGA configuration, is designed for surface mount applications, demonstrating its suitability for modern, compact electronic designs. The product operates efficiently within a temperature range of 0°C to 85°C (TJ), ensuring reliability under a variety of environmental conditions.
Engineered with an impressive array of technical specifications, the EP1S30F1020C7 includes:
– A total of 32,470 logic elements/cells that provide the computational capability.
– 3,247 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs) ensuring extensive programmability and adaptability.
– A substantial 3,317,184 total RAM bits for high-speed, integrated storage applications.
– Elevated flexibility with 726 input/output ports (I/O), facilitating broad connectivity options.
Its supplier device package is a 1020-FBGA (33×33), optimized for efficient heat dispersion and space conservation on the PCB. The active part status of this FPGA indicates its ongoing production and availability for a wide range of applications. The Stratix® series, particularly the EP1S30F1020C7, is predominantly employed in demanding industries requiring high-speed data processing and intricate logic operations including telecommunications, automotive electronics, data centers, aerospace, and defense.
This FPGA from Intel’s Stratix® series exemplifies cutting-edge technology tailored to meet the complex needs of high-performance systems, offering a blend of power, performance, and flexibility unmatched in the industry.
Download Free CAD Model:
Packaging | Bulk |
Package / Case | 1020-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 32470 |
Supplier Device Package | 1020-FBGA (33x33) |
Number of LABs/CLBs | 3247 |
Total RAM Bits | 3317184 |
Part Status | Active |
Number of I/O | 726 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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