The EP1S10F780I6N, a sophisticated Field-Programmable Gate Array (FPGA) from Intel’s renowned Stratix® series, offers a wide array of features designed for advanced computing solutions. This component comes in a 780-BBGA (Ball Grid Array) package, emphasizing its suitability for surface mount applications, and is housed in a tray packaging for secure handling and shipping.

Operating within a temperature range of 0°C to 85°C (TJ), the EP1S10F780I6N is engineered for reliability across varying environmental conditions, making it a versatile choice for numerous applications. Comprising 10,570 logic elements/cells and 1,057 Logic Array Blocks/Combinational Logic Blocks (LABs/CLBs), this FPGA is designed to handle complex processing tasks, enhancing both efficiency and performance in system-level integrations.

With 920,448 total RAM bits, it provides substantial data storage capacity, ensuring seamless data management for high-demand applications. The device also features 426 configurable I/Os, making it highly adaptable to a wide range of connectivity requirements. Encased in a 780-FBGA (29×29) supplier device package, it facilitates efficient thermal management and robust physical integration into a multitude of design architectures.

Although now classified as obsolete, the EP1S10F780I6N has been widely utilized across various sectors, including telecommunications, automotive, and digital signal processing, to name a few, underpinning its flexibility and high performance.

This FPGA stands as a testament to Intel’s commitment to delivering high-quality, reliable semiconductors that meet the intricate needs of sophisticated electronic systems, ensuring optimal performance and facilitating technological advancements across industries.