Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1K50FC256-1N is a member of Intel’s ACEX-1K® FPGA series, offering advanced integration of 2,880 logic elements/cells and 360 logic array blocks (LABs/CLBs) encapsulated in a sleek 256-Ball Grid Array (BGA) package. This surface-mount FPGA operates reliably across a temperature range of 0°C to 70°C, making it suitable for a variety of applications that require stable performance in varying thermal conditions.
With a total RAM bit count of 40,960 and provision for 186 input/output (I/O) ports, this FPGA is engineered to handle complex digital signal processing, data management, and computation tasks efficiently. The device’s package size, a 256-FBGA measuring 17×17, ensures a compact footprint, facilitating its integration into space-constrained environments.
Although noted as obsolete, the EP1K50FC256-1N remains a preferred choice for developers and engineers looking to maintain or update existing systems in industries where reliability and performance cannot be compromised. Its versatility and high-performance capabilities make it ideal for applications ranging from telecommunications and automotive systems to advanced consumer electronics and industrial control systems.
As a product developed by Intel, a leading name in semiconductor innovation, customers can trust in the design’s robustness and the chipset’s ability to deliver on the rigorous demands of modern technology applications. The ACEX-1K® series stands as a testament to Intel’s commitment to advancing FPGA technology, providing solutions that enhance system efficiency, decrease power consumption, and significantly reduce time-to-market for developers across various sectors.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-BGA |
Mounting Type | Surface Mount |
Number of Gates | 199000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 2880 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 360 |
Total RAM Bits | 40960 |
Part Status | Obsolete |
Number of I/O | 186 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 72 I/O 84PLCC
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 113 I/O 144TQFP
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |