Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1K30FC256-3 is a high-performance FPGA part of Intel’s ACEX-1K® series, meticulously designed to meet the sophisticated requirements of advanced technology applications. Housed in a 256-BGA package, this Field-Programmable Gate Array offers a compact solution for surface mount requirements, with an operating temperature range of 0°C to 70°C, ensuring reliability across various environments. The device features 1,728 logic elements/cells and 216 Logic Array Blocks/Combinational Logic Blocks, providing a versatile platform for complex digital circuit design and implementation.
With a substantial configuration of 24,576 total RAM bits and supporting 171 I/Os, the EP1K30FC256-3 stands out for its ability to manage intricate data processes and connectivity, essential in today’s digitally driven landscape. The part is encapsulated within a 256-FBGA (17×17) supplier device package, emphasizing its efficiency and high-density integration capacity for sophisticated, space-conscious applications. Despite its status as an obsolete component, the EP1K30FC256-3 remains a testament to Intel’s legacy in delivering cutting-edge technology solutions.
Typically employed in demanding industrial, computing, and telecommunications settings, this FPGA is specifically engineered to cater to the needs of highly specialized systems requiring robust processing capabilities, extensive data handling, and precise logic control. Its architectural design is pivotal for developers and engineers aiming to leverage agility, performance, and reliability in their projects, ensuring optimal results in the deployment of high-end applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-BGA |
Mounting Type | Surface Mount |
Number of Gates | 119000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 1728 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 216 |
Total RAM Bits | 24576 |
Part Status | Obsolete |
Number of I/O | 171 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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