Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1K30FC256-1N, part of Intel’s ACEX-1K® FPGA series, exemplifies high-performance programmable logic solutions encapsulated in a 256-Ball Grid Array (BGA) format, specifically designed for surface mount applications. This component operates within an ambient temperature range of 0°C to 70°C, making it ideal for a plethora of environments where reliability is paramount.
With its 1728 logic elements/cells and 216 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA is engineered to manage complex digital computations and signal processing tasks efficiently. The device also boasts a considerable 24,576 bits of RAM, enhancing its capability in handling data-intensive applications with ease.
Equipped with 171 I/O pins, the EP1K30FC256-1N offers ample connectivity options, enabling the component to interface with a broad array of peripherals and other devices within a system. This feature is particularly beneficial in designs requiring high amounts of data exchange or needing to support multiple hardware communication protocols.
Although now classified as obsolete, the EP1K30FC256-1N continues to be sought after in legacy systems and specific industrial applications where its performance characteristics and configuration flexibility are unmatched. Its utilization spans across various sectors, including but not limited to telecommunications, automotive systems, and consumer electronics, showcasing its versatility in addressing the sophisticated needs of these industries.
The packaging choice of a 256-FBGA affirms Intel’s commitment to providing compact, yet powerful solutions that cater to the ever-evolving demands of technology infrastructures, ensuring that even with its obsolescence, the EP1K30FC256-1N remains a valuable asset for specialized applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-BGA |
Mounting Type | Surface Mount |
Number of Gates | 119000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 1728 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 216 |
Total RAM Bits | 24576 |
Part Status | Obsolete |
Number of I/O | 171 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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