The EP1K30FC256-1, part of Intel’s renowned ACEX-1K® FPGA series, stands out in the field of programmable logic solutions, meticulously engineered to meet the demands of a broad spectrum of applications. This FPGA device is encapsulated in a 256-BGA (Ball Grid Array) package, specifically designed for surface mount technology, ensuring a seamless integration into various circuit boards and systems.

With its advanced specifications, including 1728 logic elements/cells and 216 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this semiconductor provides a robust platform for the development and implementation of complex digital circuits. The component’s substantial allocation of 24576 total RAM bits enhances its capacity for handling high-speed data processes and storage requirements.

Operating within a temperature range of 0°C to 70°C (TA), the EP1K30FC256-1 is optimized for reliability and performance under standard industrial conditions. Its architecture supports a considerable number of input/output ports, with 171 I/Os available for versatile connectivity, facilitating the device’s incorporation into multifaceted systems.

While now classified as obsolete, the EP1K30FC256-1 has historically been employed across various industries, showcasing its utility in telecommunications, digital signal processing, and beyond, due to its adaptability and high-performance capabilities.

The device’s packaging in trays facilitates efficient handling and storage, making it conducive for volume procurement and assembly processes. Its supplier package format, a 256-FBGA (17×17), further underscores a design that prioritizes ease of integration, reliability, and performance.