The EP1K100QC208-3N, manufactured by Intel, is a high-density FPGA from the ACEX-1K® series, designed to meet the demands of high-performance data processing applications. With its 208-BFQFP (Bumpered Fine Pitch Quad Flat Package), this component ensures reliable connectivity and durability in a compact form factor of 28x28mm, suitable for surface mount technology. This FPGA operates within an ambient temperature range of 0°C to 70°C, making it viable for use in a variety of environmental conditions.

Incorporating 4,992 logic elements/cells and 624 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP1K100QC208-3N offers a flexible and efficient solution for complex digital circuits. Its substantial on-chip memory, totaling 49,152 RAM bits, provides ample storage for data-intensive operations. Moreover, with 147 available I/O pins, it ensures adaptability in interfacing with other components in a system.

As an obsolete component, the EP1K100QC208-3N holds significance for maintenance, repair, or replication of legacy systems in industries where long-term performance and stability are crucial. These sectors may include telecommunications, automotive, and industrial automation, where the reliability and consistency of electronic components are paramount.

Overall, the EP1K100QC208-3N exemplifies Intel’s commitment to delivering sophisticated solutions that address the computing and connectivity requirements of technically advanced applications, emphasizing its role in supporting the innovation and sustainability of legacy systems across various industries.