Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Intel’s EP1K100QC208-3 is a highly capable FPGA (Field-Programmable Gate Array) belonging to the ACEX-1K® series, renowned for its versatility and efficiency in complex digital circuit implementations. It is designed with a 208-BFQFP (Bumpered Flat Quad Flat Package) which is favored for its surface mount capability, allowing for a denser packing on PCBs and thus optimizing board space. This component operates within a temperature range of 0°C to 70°C (TA), ensuring reliability across various environmental conditions.
Featuring a substantial number of logic elements/cells totaling 4992, this FPGA provides a robust framework for implementing intricate digital designs. Furthermore, it incorporates 624 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), rendering it highly adaptable to a multitude of digital logic configurations. With a considerable amount of onboard RAM totaling 49152 bits, this component facilitates significant data storage and manipulation within the FPGA, enhancing its utility in data-intensive applications.
The EP1K100QC208-3 supports up to 147 Input/Output (I/O) ports, offering vast connectivity options and interface flexibility, crucial for seamless integration into broader systems and for interfacing with a variety of peripherals and external devices. Packaged in a 208-PQFP form factor with dimensions of 28×28, it balances compactness with functional density, a critical factor in PCB design and layout optimization.
Although now classified as obsolete, the EP1K100QC208-3 has been deployed extensively across various industries, underscoring Intel’s dedication to providing solutions that meet the rigorous demands of high-speed digital processing, telecommunications, and complex computational tasks. Its legacy underscores the adaptability and reliability of the ACEX-1K® series in delivering performance and innovation.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 208-BFQFP |
Mounting Type | Surface Mount |
Number of Gates | 257000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 4992 |
Supplier Device Package | 208-PQFP (28x28) |
Number of LABs/CLBs | 624 |
Total RAM Bits | 49152 |
Part Status | Obsolete |
Number of I/O | 147 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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