The EP1K100FC256-2N, designed and manufactured by Intel, stands as a key component within the ACEX-1K® FPGA series. This particular FPGA (Field-Programmable Gate Array) is presented in a 256-BGA (Ball Grid Array) package, catering to surface mount technology applications, ensuring a streamlined integration into a wide array of circuit board designs.

Characterized by its robust configuration, the EP1K100FC256-2N operates efficiently within a temperature range of 0°C to 70°C (TA), making it a reliable option for systems requiring a stable performance within standard temperature ranges. Its architecture encompasses 4992 logic elements/cells and 624 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), which are foundational for constructing complex digital circuits.

The FPGA’s utility is further enhanced by its sizable I/O count of 186, alongside a total RAM bits capacity of 49152, providing ample room for data storage and manipulation. Packaged meticulously in a 256-FBGA (17×17) format, this component ensures a compact yet powerful solution for digital circuit design and implementation.

Notable features include:
– 256-BGA package, suitable for surface mount.
– Operational across a 0°C to 70°C temperature range.
– Contains 4992 logic elements/cells and 624 LABs/CLBs.
– Equipped with 186 I/Os and a total RAM of 49152 bits.
– Packaged in a 256-FBGA (17×17) supplier device package.

Despite its status as obsolete, the EP1K100FC256-2N remains a valuable FPGA for legacy systems in industries like telecommunications, consumer electronics, and automotive applications, where reliability and adaptability of hardware are paramount.