Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1C20F324C7 is a high-grade FPGA (Field-Programmable Gate Array) developed by Intel, under the acclaimed Cyclone® series. This component is presented in a 324-BGA (Ball Grid Array) package, utilizing a standard tray packaging method. Designed for surface mount applications, this FPGA operates efficiently within a temperature range of 0°C to 85°C (TJ).
Equipped with 20,060 logic elements/cells and 2,006 LABs/CLBs (Logic Array Blocks / Configurable Logic Blocks), the EP1C20F324C7 offers a robust platform for complex digital computing tasks. It also includes a substantial memory capacity with a total of 294,912 RAM bits, ensuring ample storage for high-demand applications.
The FPGA supports a wide I/O interface, with availability for up to 233 inputs/outputs, facilitating extensive connectivity options for various circuits. Packaged in a 324-FBGA (19×19) format, it assures a compact yet efficient footprint for integrated solutions.
Although now classified as obsolete, the Intel EP1C20F324C7 remains a powerful choice for legacy systems and applications, benefiting industries requiring precise and reliable digital logic operations. Its comprehensive feature set and high functionality make it suitable for a range of applications, from industrial control systems to complex computational tasks requiring detailed logic configurations.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 324-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 20060 |
Supplier Device Package | 324-FBGA (19x19) |
Number of LABs/CLBs | 2006 |
Total RAM Bits | 294912 |
Part Status | Obsolete |
Number of I/O | 233 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 83 I/O 100QFP
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IC FPGA 315 I/O 484FBGA
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