Intel’s EP1C12Q240C7N from the Cyclone® series represents a pivotal component in FPGA technology, reflecting a legacy of design flexibility combined with performance efficiency. The device, encapsulated in a 240-BFQFP package, caters to a wide array of applications demanding high-speed logic operations and substantial integration capabilities.

With surface mounting as its designated mounting type, this part ensures a streamlined assembly process for manufacturing lines. The product is engineered to operate within a temperature range of 0°C to 85°C (TJ), accommodating various environmental conditions without compromising performance.

Featuring 12,060 logic elements and 1,206 logic array blocks (LABs), the EP1C12Q240C7N provides a solid foundation for complex digital circuits. Its organization facilitates the realization of intricate logic functions or multiple smaller functions within a single chip, enhancing both resource utilization and system reliability.

The FPGA also boasts 239,616 total RAM bits, enabling efficient data storage and processing, crucial for applications requiring high-speed computation and temporary data holding. With 173 accessible I/O ports, designers have ample flexibility in interfacing with other components or external devices.

Key attributes of the EP1C12Q240C7N include:
– Surface Mount Technology for efficient assembly
– 240-BFQFP packaging ensuring robust physical integration
– Operability in a broad temperature spectrum (0°C ~ 85°C)
– A significant number of logic elements/cells (12,060) and LABs/CLBs (1,206)
– Extensive RAM capacity (239,616 bits)
– Versatile I/O options with 173 pins

Although now classified as obsolete, this component has served crucial roles in various industries, particularly in telecommunications, consumer electronics, and automotive systems—any sector requiring swift and dependable digital logic solutions. The EP1C12Q240C7N facilitates the development of advanced digital systems, embodying Intel’s commitment to innovation and quality in the FPGA market.